Service Introduction
Prosystems provides one-stop full-category chip packaging conversion services, supporting two-way mutual conversion among Tray, tube, taping and reel formats, solving the mismatch between purchased packaging and production, warehousing and automated production lines. With full-process anti-static non-destructive operations, standardized processes and multiple quality inspections, we quickly complete packaging rework, material distribution adaptation and mass production adaptation without damaging chip quality, helping enterprises optimize supply chain flow and fit automated production and shipping standards.
Service Pain Points & Value
Common Industry Pain Points
Purchased material packaging is single-form and cannot fit automated SMT machine production
Tray reels arrive as whole trays, not supporting small-batch distribution, stocking or sampling
Tube-packed materials are inconvenient for machine loading and cannot connect to high-speed mass production lines
Original packaging has insufficient protection, prone to moisture and damage in long-distance transport
Materials purchased through multiple channels have messy packaging specifications, making unified shipping difficult and customer complaint risk high
Customers' loose chips and unpackaged bulk materials cannot be directly put into machine production, orderly warehousing or standard shipping
Core Service Value
Zero quality loss: anti-static dust-free operations, protecting chip electrical and appearance performance throughout
Full-scenario adaptation: packaging rework as needed, perfectly matching production, warehousing, shipping and customer standards
Efficient and flexible: rapid order response, supporting small-batch trials and large-batch mass production conversion
Standardized quality control: full-process inspection and traceability, eliminating packaging misalignment, missing material and damage problems
Service Scope (Full-Combination Packaging Conversion)
Supports two-way mutual conversion and arbitrary switching of mainstream component packaging in the electronics industry, as well as bulk material custom packaging and various customized packaging rework services, comprehensively meeting customers' diverse production and shipping needs:
Basic Conventional Conversion
Tray ↔ Taping (reel)
Tray ↔ Tube (plastic tube)
Tube ↔ Taping (reel)
Bulk material custom packaging: bare die bulk materials and loose chip incoming materials can be neatly packaged into standard forms such as Tray, taping reel and tube as needed

Customized Extended Services
Supports personalized needs such as anti-static bag sub-packaging, custom-spec reels, special label marking, grade classification packaging and custom protective packaging, customizing enterprises' exclusive shipping standards on demand.
Standardized Service Process (Transparent & Traceable)
Needs Communication + Chip Pre-Inspection
Deep communication on customer needs, confirming chip model, quantity, original packaging (including unpackaged bulk), target packaging and special requirements; pre-inspection of chip appearance and electrical performance to confirm materials are intact and meet conversion and packaging operation conditions.
Customized Solution Review & Confirmation
Combining material characteristics with customer production standards, custom packaging conversion solutions are developed, specifying equipment processes, operation standards and quality control points. Production starts after customer confirmation to eliminate deviations.
Equipment Calibration + Material Quality Inspection
Conversion equipment is debugged and precision-calibrated to ensure stable operation; all taping, carrier tapes, reels and anti-static auxiliary materials pass incoming inspection before use, ensuring materials and specifications meet standards.
Non-Destructive Conversion + Standardized Operations
Operations run in a full-process anti-static, constant temperature and humidity environment with professional tools for material handling, preventing static damage, physical collision and pin damage; for conventional packaging exchange and bulk re-packaging scenarios, processes such as chip sorting, alignment, taping, tray placement and tube loading are precisely completed, ensuring neat placement and accurate positioning, fully meeting industry standards and customer production requirements.
Multiple Full-Inspection Quality Control
After packaging conversion, chip position accuracy, packaging sealing and appearance integrity are inspected item by item, with electrical performance retested; defective materials are separately marked and isolated, traced and rectified, ensuring 100% qualified finished products.
Standardized Delivery + Acceptance Coordination
Finished products are classified, packaged and labeled per customer standards, clearly marked with model, batch, quantity and production date; delivered on time with customer acceptance coordination, complete delivery documentation and full traceability.
Four Quality Assurance Systems
Professional personnel guarantee: operators are certified, trained in systematic processes, static protection and quality control, working to standardized specifications.
Precision equipment guarantee: equipment undergoes regular maintenance and calibration, stably delivering high-precision packaging conversion results and avoiding process errors.
Operating environment guarantee: constant temperature, humidity and anti-static working area with strict environmental control, preventing chips from moisture, oxidation and static damage.
Three-level quality inspection guarantee: self-inspection, mutual inspection and special inspection triple quality control with full-process node control, eliminating quality hazards layer by layer.
Exclusive After-Sales Service
Round-the-clock technical consultation: 7x24 after-sales Q&A and technical support to quickly resolve customer questions.
Rapid problem response: for packaging conversion related quality issues, immediate contact, traceability and rectification with complete solutions.
Continuous service optimization: regular customer visits to collect needs and feedback, continuously optimizing processes and service systems to fit customers' evolving needs.